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z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 customer approved by checked by supplier approved by drawn by specification [STW0Q14A]
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 contents 1. description 2. absolute maximum ratings 3. electro-optical characteristics 4. optical characteristics 5. reliability test items and conditions 6. color & binning 7. bin code description 8. outline dimension 9. material structure 10. reel structure 11. packing 12. soldering 13. precaution for use 14. handling of silicone resin leds
z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 02 rev. 02 april, 2011 april, 2011 STW0Q14A ? pb-free reflow soldering application ? rohs compliant ? white colored smt package ? suitable for all smt assembly and soldering methods ? high reliability (silicone resin) ? electric signs and signals ? office automation, electrical appliances, industrial equipment features applications 1. description this surface-mount led comes in standard package dimension. it has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. the die is attached within the reflector cavity and the cavity is encapsulated by silicone. the package design coupled with careful selection of component materials allow these products to perform with high reliability.
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 2. absolute maximum ratings *1 3. electric characteristics 125 t j junction temperature -40 ~ +100 t stg storage temperature -40 ~ +85 t opr operating temperature ma 150 i fm [2] peak forward current ma 80 i f forward current mw 272 p d power dissipation unit value symbol parameter [1] care is to be taken that power dissipation does not exceed the absolute maximum rating of the prod uct. [2] ifm was measured at tw 1 msec of pulse width and d 1/10 of duty ratio. [3] leds properties might be different from sugges ted values like above and below tables if operation condition will be exceeded our parameter range. kv - - 5 1.5k ? ;100pf esd (hbm) oc/w 22 i f =60ma r th js thermal resistance [4] k 8200 - 4700 i f =60ma cct color correlated temperature lm - 15 - i f =60ma luminous flux deg. - 120 - i f =60ma 2 1/2 viewing angle [3] - - 68 - i f =60ma ra color rendering index* cd - 5.2 - i f =60ma i v luminous intensity* [2] v 1.2 0.85 - i r =5ma v r reverse voltage v 3.4 3.2 2.9 i f =60ma v f forward voltage * [1] unit max. typ. min. condition symbol parameter [1] forward current is 60ma per die. [2] the luminous intensity iv was measured at the p eak of the spatial pattern which may not be aligne d with the mechanical axis of the led package. [3] 2 1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [4] thermal resistance: r th js (junction / solder), metal pcb 25*25mm 1.6t * tolerance : v f : 0.1v, i v : 10%, x,y : 0.01 [note] all measurements were made under the standar dized environment of ssc.
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 4. optical characteristics forward voltage vs. forward current ta=25 forward current vs. relative luminous intensity ta=25 0 10 20 30 40 50 60 70 80 90 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 relative luminous intensity forward current i f [ma] 3.0 3.2 3.4 3.6 3.8 4.0 1 10 100 forward current i f [ma] forward voltage v f [v] directivity ta=25 0 30 60 90 120 150 180 forward current vs. chromaticity coordinate ta=25 0.285 0.286 0.287 0.288 0.289 0.290 0.291 0.294 0.296 0.298 0.300 0.302 0.304 20ma 60ma 100ma 150ma 200ma y x
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 relative light output vs. junction temperature i f =60ma forward voltage shift vs. junction temperature i f =60ma 40 60 80 100 120 0.0 0.2 0.4 0.6 0.8 1.0 relative light output junction temperation t j (? ) 40 60 80 100 120 0.0 0.2 0.4 0.6 0.8 1.0 relative forward voltage junction temperation t j (? ) junction temperature ( ) vs. chromaticity coordinate if=60ma 0.270 0.275 0.280 0.285 0.290 0.295 0.280 0.285 0.290 0.295 0.300 0.305 0.310 25 44 64 84 104 y x
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 -40 -20 0 20 40 60 80 100 0 20 40 60 80 forward current i f [ma] ambient temperature t a [ o c] ambient temperature vs. maximum forward current rth rthrth rth j jj j- -- -a a a a = 200 = 200 = 200 = 200 /w /w /w /w spectrum ta=25 , i f =60ma 300 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 relative emission intensity wavelength [nm]
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 5. reliability test items and conditions - lsl [2] 0.7 i f =60ma i v luminous intensity usl [1] 1.2 - i f =60ma v f forward voltage max min criteria for judgment condition symbol item note : [1] usl : upper standard level [2] lsl : lower standard level criteria for judging the damage 0/22 3 time 260 < 10sec. reflow soldering t sol reflow 0/22 3 time 5kv at 1.5k ? ; 100pf mil-std- 883d esd(hbm) 0/22 1000 hours t a =-40 o c, i f =60ma internal reference low temperature life test 0/22 500 hours t a =85 o c, i f =60ma internal reference high temperature life test 0/22 500 hours t a =60 o c, rh=90%, i f =60ma internal reference high temperature high humidity life test 0/22 1000 hours t a =25 o c, i f =60ma internal reference operating endurance test 0/22 1000 hours t a =-40 o c eiaj ed-4701 low temperature storage 0/22 1000 hours t a =60 o c, rh=90% eiaj ed-4701 high temp. high humidity storage 0/22 1000 hours t a =100 o c eiaj ed-4701 high temperature storage 0/22 100 cycle t a =-40 o c(30min) ~ 100 o c(30min) eiaj ed-4701 thermal shock number of damaged duration / cycle test conditions reference item
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 6. color & binning energy star rank energy star rank 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 4700k 5000k z7 z6 z5 z4 z3 z1 z2 8200k 7000k c6 b6 c4 b4 c2 b2 c0 b0 a7 a6 a5 a4 a3 a2 a1 5300k 5600k 6000k 6500k cie y 7600k cie x a0 b1 b3 b5 b7 c1 c3 c5 c7
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 6. color & binning color rank 0.3261 0.3221 0.3187 0.3146 0.3334 0.3216 0.3190 0.3225 0.3120 0.3155 0.3261 0.3221 0.3120 0.3155 0.3046 0.3082 0.3187 0.3146 0.3187 0.3146 0.3113 0.3068 0.3256 0.3136 cie y cie x cie y cie x cie y cie x a7 a6 a5 0.3256 0.3136 0.3408 0.3210 0.3324 0.3126 0.3481 0.3205 0.3393 0.3115 0.3187 0.3146 0.3334 0.3216 0.3256 0.3136 0.3408 0.3210 0.3324 0.3126 0.3113 0.3068 0.3256 0.3136 0.3177 0.3055 0.3324 0.3126 0.3240 0.3041 0.3177 0.3055 0.3324 0.3126 0.3240 0.3041 0.3393 0.3115 0.3304 0.3028 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x a4 a3 a2 a1 a0 0.3113 0.3068 0.3047 0.3009 0.3046 0.3082 0.2985 0.3025 0.2985 0.3025 0.2919 0.2969 0.3047 0.3009 0.298 0.295 cie y cie x cie y cie x z7 z6 0.3177 0.3055 0.3107 0.2993 0.324 0.3041 0.3166 0.2976 0.3304 0.3028 0.3113 0.3068 0.3047 0.3009 0.3177 0.3055 0.3107 0.2993 0.324 0.3041 0.3047 0.3009 0.298 0.295 0.3107 0.2993 0.3037 0.293 0.3166 0.2976 0.3107 0.2993 0.3037 0.293 0.3166 0.2976 0.3093 0.291 0.3227 0.2959 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x z5 z4 z3 z2 z1
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 6. color & binning color rank 0.3487 0.3514 0.3578 0.3526 0.3669 0.3539 0.376 0.3552 0.34 0.35 0.3487 0.3514 0.3578 0.3526 0.3669 0.3539 0.3345 0.3433 0.3428 0.344 0.3514 0.3448 0.3601 0.3456 0.3428 0.344 0.3514 0.3448 0.3601 0.3456 0.3687 0.3463 cie y cie x cie y cie x cie y cie x cie y cie x c7 c5 c3 c1 0.3428 0.344 0.3514 0.3448 0.3601 0.3456 0.3687 0.3463 0.3345 0.3433 0.3428 0.344 0.3514 0.3448 0.3601 0.3456 0.3288 0.3364 0.3369 0.3366 0.3451 0.3369 0.3534 0.3373 0.3369 0.3366 0.3451 0.3369 0.3534 0.3373 0.3616 0.3376 cie y cie x cie y cie x cie y cie x cie y cie x c6 c4 c2 c0 0.3369 0.3366 0.3306 0.3294 0.3451 0.3369 0.3288 0.3364 0.3234 0.3295 0.3369 0.3366 0.3234 0.3295 0.3178 0.3226 0.3306 0.3294 0.3306 0.3294 0.3243 0.3222 0.3384 0.3293 cie y cie x cie y cie x cie y cie x b7 b6 b5 0.3384 0.3293 0.3534 0.3373 0.3461 0.3293 0.3616 0.3376 0.3539 0.3292 0.3306 0.3294 0.3451 0.3369 0.3384 0.3293 0.3534 0.3373 0.3461 0.3293 0.3243 0.3222 0.3384 0.3293 0.3316 0.3217 0.3461 0.3293 0.3389 0.3212 0.3316 0.3217 0.3461 0.3293 0.3389 0.3212 0.3539 0.3292 0.3462 0.3207 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x b4 b3 b2 b1 b0
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 z1 a0 n0 forward voltage cie luminous intensity bin code z~c color rank @ i f = 60ma 3.4 3.3 a1 3.0 2.9 y3 3.1 3.0 z1 3.2 3.1 z2 3.3 3.2 z3 max. min. bin code forward voltage (v) @ i f = 60ma 21 7.0 6.5 p5 19.2 17.7 16.5 typ flux [lm] 6.5 6.0 p0 5.5 5.0 n0 6.0 5.5 n5 max. min. bin code luminous intensity (cd) @ i f = 60ma [note] all measurements were made under the standar dized environment of ssc. in order to ensure availability, single color rank will not be orderable. 7. bin code description available ranks not yet available ranks 4700~6000 k (cie b,c) p0 n5 n0 p0 n5 n0 6000~8200k (cie z,a) iv rank cct
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 8. outline dimension si thermo plastic silicone metal blue led metal description description description description - zener diode +phosphor encapsulation gold wire wire gan on sapphire chip source heat- resistant polymer body copper alloy (silver plated) lead frame materials materials materials materials name name name name parts no. parts no. parts no. parts no. 8. outline dimension a c slug (anode) slug (anode) slug (anode) slug (anode) n.c n.c n.c n.c package package package package marking marking marking marking ( tolerance: 0.1, unit: mm ) [note] package forward current is 100ma n.c n.c n.c n.c esd protection device 2 1 anode cathode circuit diagram diagram diagram diagram 9. material structure 0.65 2.80 0.65 1.10 1.10 0.40 1.80 4.10 0.95 [recommended solder pattern]
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 180 2 13 22 60 15.4 1.0 13 0.3 10. reel structure ( tolerance: 0.2, unit: mm ) (1) quantity : 3,500pcs/reel (2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm (3) adhesion strength of cover tape : adhesion stre ngth to be 0.1-0.7n when the cover tape is turned o ff from the carrier tape at the angle of 10o to the carrier tape (4) package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 11. soldering 10 sec. max. soldering time condition 240 max. peak-temperature 120 sec. max. pre-heat time 120~150 pre-heat lead solder 10 sec. max. soldering time condition 260 max. peak-temperature 120 sec. max. pre-heat time 150~200 pre-heat lead free solder lead solder 2.5~5 c / sec. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. (1) lead solder (2) lead-free solder lead-free solder 1~5 c / sec. o o o o 1~5 c / sec. pre-heating 150~200 c 120sec. max. 60sec. max. above 220 c o 260 c max. 10 sec. max. (3) hand soldering conditions do not exceed 4 seconds at maximum 315oc under sold ering iron. (4) the encapsulated material of the leds is silicon e. precautions should be taken to avoid the strong pre ssure on the encapsulated part. so when using the chip mounter, the picking up nozz le that does not affect the silicone resign should be used. (5) it is recommended that the customer use the nit rogen reflow method. (6) repairing should not be done after the leds have been soldered. (7) reflow soldering should not be done more than t wo times. in the case of more than 24 hours passed soldering after first, leds will be damaged.
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 c a b 1 side 7inch 245 220 142 size (mm) outer box structure material : paper(sw3b(b)) type a b c 1 humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. rohs 12. packing
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 13. precaution for use (1) storage in order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. otherwise, to store th em in the following environment is recommended. temperature : 5oc ~30oc humidity : maximum 70%rh (2) attention after open. led is correspond to smd, when led be soldered dip, interfacial separation may affect the light transmission efficiency, causing the ligh t intensity to drop. attention in followed; keeping of a fraction temperature : 5 ~ 40oc humidity : less than 10% (3) in the case of more than 1 week passed after op ening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60 5oc. (4) silver plating might be tarnished in the enviro nment that contains corrosive gases and materials. also any product that has tarnished lead might be decreased the solder-ability and optical-electrical properties co mpare to normal ones. please do not expose the product in the corrosive e nvironment during the storage. (5) any mechanical force or any excess vibration sh all not be accepted to apply during cooling process to normal temperature after solderi ng. (6) quick cooling shall be avoided. (7) components shall not be mounted on warped direc tion of pcb. (8) anti radioactive ray design is not considered f or the products. (9) this device should not be used in any type of f luid such as water, oil, organic solvent etc. when washing is required, ipa should b e used. (10) when the leds are illuminating, operating curre nt should be decided after considering the ambient maximum temperature. (11) the leds must be soldered within seven days aft er opening the moisture-proof packing. (12) repack unused products with anti-moisture pack ing, fold to close any opening and then store in a dry place. (13) the appearance and specifications of the produ ct may be modified for improvement without notice.
z-power led x10490 z-power led x10490 technical data sheet rev. 02 rev. 02 april, 2011 april, 2011 document no. : ssc- qp- 7- 07- 24 14. handling of silicone resin leds 1) during processing, mechanical stress on the surf ace should be minimized as much as possible. sharp objects of all types should not be used to pi erce the sealing compound. 2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surface can a lso become scratched. 3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical press ure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. 4) silicone differs from materials conventionally u sed for the manufacturing of leds. these conditions must be considered during the handling of such devi ces. compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level of dirt and dust par ticles cannot be guaranteed, a suitable cleaning sol ution must be applied to the surface after the soldering of components. 5) ssc suggests using isopropyl alcohol for cleanin g. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. 6) please do not mold this product into another res in (epoxy, urethane, etc) and do not handle this product with acid or sulfur mate rial in sealed space.

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